描述
Feature
- Light and shadow streamline aesthetic design
- Reinforced structure to enhance heat dissipation
- Supports Intel XMP3.0 one-click overclocking technology
- Equipped with a power management chip, the power is stable and more efficient
- Enhanced heat dissipation design of power management chip
- On-die ECC debugging mechanism makes the system more stable
- Carefully selected high-quality IC, stable and reliable